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SEMICONDUCTOR DEVICE CAPABLE OF DUALLY BLOCKING ELECTROMAGNETIC WAVES, A SEMICONDUCTOR PACKAGE, AND AN ELECTRONIC DEVICE

机译:具有双阻塞电磁波的半导体器件,半导体封装和电子器件

摘要

PURPOSE: A semiconductor device, a semiconductor package, and an electronic device are provided to effectively protect an electronic device from external electromagnetic waves by including an electromagnetic wave shielding structure equipped with first and second polarizers having transmission shafts which cross at right angles each other.;CONSTITUTION: A first semiconductor package(PKGA1) and a second semiconductor package(PKGB1) are separately placed on a circuit board(100a). The first semiconductor package comprises a first semiconductor chip(PCH1a). The second semiconductor package comprises a second semiconductor chip(PCH1b). A first electromagnetic wave shielding structure(ESS1_1) covers the top surface and side of the first semiconductor package. A second electromagnetic wave shielding structure(ESS1_2) covers the top surface and side of the second semiconductor package. A conductive electromagnetic wave shielding structure(CS1) covers the first and second semiconductor packages and the first and second electromagnetic wave shielding structures.;COPYRIGHT KIPO 2013
机译:目的:提供一种半导体器件,半导体封装件和电子设备,以通过包括电磁波屏蔽结构来有效地保护电子设备免受外部电磁波的干扰,该电磁波屏蔽结构配备有第一和第二偏振器,第一和第二偏振器具有彼此垂直成直角的透射轴。组成:第一半导体封装(PKGA1)和第二半导体封装(PKGB1)分别放置在电路板(100a)上。第一半导体封装包括第一半导体芯片(PCH1a)。第二半导体封装包括第二半导体芯片(PCH1b)。第一电磁波屏蔽结构(ESS1_1)覆盖第一半导体封装的顶面和侧面。第二电磁波屏蔽结构(ESS1_2)覆盖第二半导体封装的顶面和侧面。导电电磁波屏蔽结构(CS1)覆盖第一和第二半导体封装以及第一和第二电磁波屏蔽结构。; COPYRIGHT KIPO 2013

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