POWER MODULE PACKAGE AND A MANUFACTURING METHOD THEREOF CAPABLE OF MINIATURIZATION OF A MODULE

摘要

PURPOSE: A power module package and a manufacturing method thereof are provided to improve thermal properties by reducing heat transfer from a power circuit to a control circuit.;CONSTITUTION: A substrate(110) has a low part and a high part. A power circuit(120) is included on the low part. The power circuit is electrically connected to a circuit wiring. A control circuit(130) is included on the high part. The control circuit is electrically connected to the circuit wiring. A molding part(140) seals the power circuit.;COPYRIGHT KIPO 2013