Thermally Conductive Via Paste For Non-Sintering Ceramic Substrate And Thermally Conductive Via Manufacturing Method Using The Same

摘要

PURPOSE: A thermal conductive via paste for a non-sintering multi-layer circuit board and a heat radiation via forming method using the same are provided to form a via structure by only using an ink-jet process. CONSTITUTION: A first dielectric layer(12) is formed on a substrate(11) by using an ink-jet process. A first via hole(13) is formed on the first dielectric layer using a laser drill. A first thermal conductive via paste(14) is filled in the via hole. A circuit wiring(15) is formed on the substrate using conductive ink. A second dielectric layer(16) is formed on the substrate. A protective layer film(18) is attached on the top part of the heat radiation package substrate. A third via hole(19) for heat radiation is formed by a laser drilling method. A second thermal conductive via paste(20) is filled in the third via hole.