BONDING MATERIAL GUIDE DEVICE CAPABLE OF REDUCING AN IMPACT FORCE TRANSMITTED TO THE DEVICE WHEN A MATERIAL IS BONDED BY HAVING THE MAIN BODY OF THE DEVICE SEPARATED FROM A BONDING FACILITY

摘要

PURPOSE: A bonding material guide device is provided to control the position of the main body of the device according to movement of a bonding material, thereby maintaining an optical bonding strength and facilitating smooth progression of the material.;CONSTITUTION: A bonding material guide device includes a main body(10) and a position controlling means(20). The main body(10) is separately placed on one side of a bonding facility(100), and includes a guide roll(12) which guides the transfer of the material. The position controlling means(20) is provided to control the position of the main body(10) in response to the movement of the material. The position controlling means(20) includes an actuating part(22) and connecting part(24). The actuating part(22) provides an actuating force for moving the main body(10). The connecting part(24) transmits the actuating force by connecting the main body(10) to the actuating part(22). The connecting part(24) is a linker. The linker rotates on the center thereof in order to transform the linear motion of the actuating part(22) into the curvilinear motion of the main body(10). A rotation detecting part is formed in the main body(10) for detecting the rotation state of the guide roll(12).;COPYRIGHT KIPO 2013