首页> 外国专利> SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE HAVING THE SUBSTRATE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE CAPABLE OF IMPROVING THE ELECTRICAL CHARACTERISTIC OF THE SEMICONDUCTOR DEVICE

SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE HAVING THE SUBSTRATE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE CAPABLE OF IMPROVING THE ELECTRICAL CHARACTERISTIC OF THE SEMICONDUCTOR DEVICE

机译:用于半导体装置的基板,具有该基板的半导体装置以及用于制造能够改善该半导体装置的电气特性的半导体装置的方法

摘要

PURPOSE: A substrate for a semiconductor device, a semiconductor device having the substrate and a method for manufacturing the semiconductor device are provided to form the uniform thickness of a dielectric layer by using an anode oxidation method for forming an insulating layer.;CONSTITUTION: A first metal line part(140) is electrically connected to a first electrode of a semiconductor device. A second metal line part(150) is electrically connected to a second electrode of the semiconductor device. A metal support part is arranged between the first metal line part and the second metal line part. A first insulation part(120) electrically insulates the first metal line part and the metal support part. A second insulation part(130) electrically insulates the second metal line part and the metal support part.;COPYRIGHT KIPO 2013
机译:目的:提供一种用于半导体器件的衬底,具有该衬底的半导体器件以及用于制造该半导体器件的方法,以通过使用阳极氧化法形成绝缘层来形成均匀厚度的介电层。第一金属线部分(140)电连接到半导体器件的第一电极。第二金属线部分(150)电连接到半导体器件的第二电极。在第一金属线部分和第二金属线部分之间布置金属支撑部分。第一绝缘部分(120)使第一金属线部分和金属支撑部分电绝缘。第二绝缘部分(130)将第二金属线部分和金属支撑部分电绝缘。; COPYRIGHT KIPO 2013

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