APPARATUS AND METHOD FOR DETECTING ERRORS IN A CMP PROCESS IN REAL TIME CAPABLE OF PREVENTING A PLURALITY OF WAFERS FROM BEING DAMAGED

摘要

PURPOSE: An apparatus and method for detecting errors in a CMP process are provided to prevent damage by removing hard corpuscles before the CMP process.;CONSTITUTION: A wafer carrier(21) is located to contact the surface of a semiconductor wafer(31) with a polishing pad mounted on a rotating platen(13). Polishing slurry is distributed on the rotating polishing pad while maintaining a contact between the surface of the semiconductor wafer and the polishing pad. A single analyzer receives signals from a CMP tool in real time. The signals received from the CMP tool are compared with signals which are normally processed by the CMP tool.;COPYRIGHT KIPO 2013