首页> 外国专利> MANUFACTURING METHOD OF AN ENVIRONMENTALLY FRIENDLY RED CLAY CHIP WITH STRONG BINDING FORCE AND A PAVING METHOD USING THE SAME

MANUFACTURING METHOD OF AN ENVIRONMENTALLY FRIENDLY RED CLAY CHIP WITH STRONG BINDING FORCE AND A PAVING METHOD USING THE SAME

机译:具有强结合力的环保型红色黏土芯片的制造方法及使用该方法的摊铺方法

摘要

PURPOSE: A manufacturing method of an environmentally friendly chip with a strong binding force is provided to provide a red clay-paved side with excellent elasticity, rigidity, and durability.;CONSTITUTION: A manufacturing method of a red clay chip comprises a step of spreading 1-50 parts by weight of red clay, 1-50 parts by weight of a moisture-curable one-component urethane binder, 0-5 parts by weight of a coating zero containing a phenol resin, and 100.0 parts by weight of elastic chips. A paving method of a red clay elastic pavement side comprises a step of manufacturing the red clay chip with a red clay coating layer on the surface of an elastic chip; a step of paving the red clay coating chip on a surface with a binder; and a step of forming an elastic layer by paving the mixture material.;COPYRIGHT KIPO 2013
机译:目的:提供一种具有强结合力的环保芯片的制造方法,以提供具有优异的弹性,刚度和耐用性的红粘土铺面。;组成:红粘土芯片的制造方法包括铺展步骤1-50重量份的红土,1-50重量份的可湿固化的单组分聚氨酯粘合剂,0-5重量份的包含酚醛树脂的涂料零和100.0重量份的弹性碎片。红粘土弹性铺面的铺砌方法包括以下步骤:制造在弹性碎屑表面上具有红粘土涂层的红粘土碎屑。用粘合剂将红粘土涂层碎屑铺在表面上的步骤;以及通过铺展混合物材料形成弹性层的步骤。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130026827A

    专利类型

  • 公开/公告日2013-03-14

    原文格式PDF

  • 申请/专利权人 ECOTECH CO. LTD.;

    申请/专利号KR20110090243

  • 发明设计人 KIM SEONG NHO;

    申请日2011-09-06

  • 分类号C08J7/04;B29B17/00;C09D175/04;E01C15/00;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:31

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