PRINTED CIRCUIT BOARD CAPABLE OF ADOPTING A STRUCTURE IN WHICH A PAD IS DIRECTLY CONNECTED TO A METAL PATTERN LAYER FOR AN INTERLAYER ELECTRIC CONNECTION WITHOUT A VIA AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to enable a high densification or thinning of a substrate and reduce a manufacturing cost.;CONSTITUTION: A metal pattern layer(120) forms a pattern on a metal layer. The metal pattern layer forms a pattern by removing a part of the metal layer and forms a plating layer on the metal layer on which the pattern is formed. A resist(140) includes a first resist(142) and a second resist(144). The first resist is coated on one side of the metal pattern layer and opens a first pad formation area. The second resist is coated on the other side of the metal pattern layer and opens a second pad formation area. A pad(160) includes a first pad(162) and a second pad(164). The first pad is formed in the first pad formation area. The second pad is formed in the second pad formation area.;COPYRIGHT KIPO 2013