Nonintrusive System for Replication of interlayer Printed Circuit Patterns

摘要

Report developed under SBIR contract. The overall objective of this Phase I research program was to develop a nonintrusive method to image the art work of interlayer printed circuit board. Using forward Compton scattering and innovative design of a high-efficiency and high-resolution ring-slit Compton scattering camera, we have both theoretically demonstrated and experimentally verified the feasibility of reverse engineering the circuit board. An algorithm using 2-D projection and Compton scattering data was proposed for image reconstruction of the layout of the printed circuit board, layer by layer. This algorithm is highly efficient, less computational, straightforward, and easy to implement.