FACING TARGET TYPE CYLINDRICAL SPUTTERING CATHODE DEVICE CAPABLE OF IMPROVING DEPOSITION QUALITY

摘要

PURPOSE: A facing target type cylindrical sputtering cathode device is provided to improved deposition quality by precisely controlling deposition conditions, deposition rate, and energy reaching from target substances to a substrate.;CONSTITUTION: A facing target type cylindrical sputtering cathode device comprises cylindrical sputtering units(10) and an auxiliary beam supply unit(20). Each cylindrical sputtering unit comprises a cylindrical target(11), a magnet(17), and an angle control unit. The magnet is received inside the target to be changed a rotation angle. The angle control unit controls the rotation angle of the magnet. The auxiliary beam supply unit supplies auxiliary beams between the targets of the cylindrical sputtering units.;COPYRIGHT KIPO 2013