BASE FOR AN OPTICAL SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF, AND AN OPTICAL SEMICONDUCTOR DEVICE, CAPABLE OF IMPLEMENTING HIGH DURABILITY AND HIGH HEAT DISSIPATION PROPERTY

摘要

PURPOSE: A base for an optical semiconductor device and a manufacturing method thereof, and an optical semiconductor device are provided to dissipate heat generated from a semiconductor chip through a chip mounting portion efficiently.;CONSTITUTION: A metal frame (4) has a plurality of chip mounting parts (2) and a plurality of signal connection parts (3). The plurality of chip mounting parts is mounted with a semiconductor chip. The plurality of signal connection parts is electrically connected to the semiconductor chip. The plurality of signal connection parts provides an electrode part to the outside. A resin part (5) is buried in a part except the plurality of chip mounting parts and the plurality of signal connection parts.;COPYRIGHT KIPO 2013