LOW VISCOSITY ETCHING SOLUTION FOR FORMING A METAL WIRE CAPABLE OF OBTAINING EXCELLENT PROFILE, AND CONTROLLING ETCHING RATE

摘要

PURPOSE: A low viscosity etching solution is provided to control etching rate in wide range, to maintain etching uniformity, and to reduce taper angle.;CONSTITUTION: An etching solution not including hydroperoxide includes 5-40 wt% of sulfuric acid, 0.5-30 wt% of a nitric acid, 0.1-10 wt% of halogen additives, 0.5-20 wt% of an inorganic chelate agent, and residual water. The halogen additives are selected from HF, (NH4)F, (NH4)HF2, KF, NaF, MgF2, AlF3, HCl, (NH4)Cl, KCl, NaCl, MgCl2, FeCl3, AlCl3, HBr, (NH4)Br, KBr, NaBr, MgBr2, AlBr3, HI, (NH4)I, KI, NaI, MgI2, and A1I3.;COPYRIGHT KIPO 2013