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METHOD FOR MANUFACTURING A PHOTONIC CRYSTAL BAND-GAP ELEMENT USING A WET ETCHING PROCESS, CAPABLE OF IMPROVING PRECISION

机译:利用湿法刻蚀工艺制造光子晶体带隙元件的方法,能够提高精度

摘要

PURPOSE: A method for manufacturing a photonic crystal band-gap element using a wet etching process is provided to utilize a chemical-mechanical polishing (CMP) process, thereby easily manufacturing the element.;CONSTITUTION: A method for manufacturing a photonic crystal band-gap element using a wet etching process includes: a step (105) of bonding two wafers with a metal layer; a step (110) of implementing a chemical-mechanical polishing (CMP) process on the upper wafer, and adjusting the thickness of the upper wafer; a step (120) of forming a mask pattern using a photosensitive etching mask; and a step (125) of implementing a wet etching process on the mask pattern.;COPYRIGHT KIPO 2013;[Reference numerals] (105) Wafer bonding; (110) Chemical-mechanical polishing; (115) Photonic crystal structure compensating circuit construction; (120) Pattern formation; (125) Preparation through a wet etch process; (AA) Start; (BB) End
机译:目的:提供一种利用湿法刻蚀工艺制造光子晶体带隙元件的方法,以利用化学机械抛光(CMP)工艺,从而易于制造该元件。;构成:一种制造光子晶体带隙元件的方法:使用湿蚀刻工艺的间隙元件包括:将两个晶片与金属层接合的步骤(105);步骤(110),在所述上晶片上实施化学机械抛光(CMP)工艺,并调节所述上晶片的厚度;使用光敏蚀刻掩模形成掩模图案的步骤(120); COPYRIGHT KIPO 2013; [105]晶片键合;以及在掩模图案上实施湿法蚀刻工艺的步骤(125)。 (110)化学机械抛光; (115)光子晶体结构补偿电路的构造; (120)图案形成; (125)通过湿蚀刻工艺进行制备; (AA)开始; (BB)结束

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