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ELECTROSTATIC CAPACITY PRESSURE SENSOR PACKAGE WHICH MEASURES THAT A DISTANCE BETWEEN TWO ELECTRODE PATTERNS IS CHANGED BY THE PRESSURE ADDED FROM OUTSIDE USING ELECTROSTATIC CAPACITY AND A MANUFACTURING METHOD THEREOF
ELECTROSTATIC CAPACITY PRESSURE SENSOR PACKAGE WHICH MEASURES THAT A DISTANCE BETWEEN TWO ELECTRODE PATTERNS IS CHANGED BY THE PRESSURE ADDED FROM OUTSIDE USING ELECTROSTATIC CAPACITY AND A MANUFACTURING METHOD THEREOF
PURPOSE: An electrostatic capacity pressure sensor package and a manufacturing method thereof are provided to omit the performance of a lithography process for the formation of an electrode pattern.;CONSTITUTION: An electrostatic capacity pressure sensor package comprises a circuit board (11), a superstructure (31), and a housing. A first electrode pattern (15) is formed on the circuit board. The superstructure comprises a second electrode pattern (21a) which faces to a first electrode pattern in order to be transformed towards the first electrode pattern by pressure, and a supporting part (21b) which supports both ends of the second electrode pattern. The lower end surface of the superstructure is arranged to be contacted to the surface of the circuit. The housing is combined with the circuit in order to accept the superstructure within an internal space.;COPYRIGHT KIPO 2013
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