首页> 外国专利> ELECTROSTATIC CAPACITY PRESSURE SENSOR PACKAGE WHICH MEASURES THAT A DISTANCE BETWEEN TWO ELECTRODE PATTERNS IS CHANGED BY THE PRESSURE ADDED FROM OUTSIDE USING ELECTROSTATIC CAPACITY AND A MANUFACTURING METHOD THEREOF

ELECTROSTATIC CAPACITY PRESSURE SENSOR PACKAGE WHICH MEASURES THAT A DISTANCE BETWEEN TWO ELECTRODE PATTERNS IS CHANGED BY THE PRESSURE ADDED FROM OUTSIDE USING ELECTROSTATIC CAPACITY AND A MANUFACTURING METHOD THEREOF

机译:静电电容压力传感器包装,该方法通过使用静电电容及其外部制造方法来测量由于外部增加的压力而改变两种电极图案之间的距离

摘要

PURPOSE: An electrostatic capacity pressure sensor package and a manufacturing method thereof are provided to omit the performance of a lithography process for the formation of an electrode pattern.;CONSTITUTION: An electrostatic capacity pressure sensor package comprises a circuit board (11), a superstructure (31), and a housing. A first electrode pattern (15) is formed on the circuit board. The superstructure comprises a second electrode pattern (21a) which faces to a first electrode pattern in order to be transformed towards the first electrode pattern by pressure, and a supporting part (21b) which supports both ends of the second electrode pattern. The lower end surface of the superstructure is arranged to be contacted to the surface of the circuit. The housing is combined with the circuit in order to accept the superstructure within an internal space.;COPYRIGHT KIPO 2013
机译:目的:提供一种静电电容压力传感器封装及其制造方法,以省略用于形成电极图案的光刻工艺。;组成:一种静电电容压力传感器封装,包括电路板(11),上部结构(31)和一个房屋。在电路板上形成第一电极图案(15)。上部结构包括:第二电极图案(21a),其面对第一电极图案,以便通过压力朝向第一电极图案变形;以及支撑部分(21b),其支撑第二电极图案的两端。上部结构的下端面布置成与电路的表面接触。外壳与电路相结合,以便在内部空间中容纳上层建筑。; COPYRIGHT KIPO 2013

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