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PHYSICAL VAPOR DEPOSITION PLATING APPARATUS OF A GUIDE ROLL AND A PLATING METHOD THEREOF CAPABLE OF FORMING A PLATING LAYER BY ION-CLEANING AND SPUTTERING IN MULTIPLE VACUUM CHAMBERS
PHYSICAL VAPOR DEPOSITION PLATING APPARATUS OF A GUIDE ROLL AND A PLATING METHOD THEREOF CAPABLE OF FORMING A PLATING LAYER BY ION-CLEANING AND SPUTTERING IN MULTIPLE VACUUM CHAMBERS
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机译:导辊的物理气相沉积设备及其能够通过离子清洗和溅射在多个真空室中形成镀层的镀膜方法
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PURPOSE: A physical vapor deposition plating apparatus of a guide roll and a plating method thereof are provided to obtain a plating layer without cracks and to prevent the generation of waste matters which are harmful to environments.;CONSTITUTION: A physical vapor deposition plating apparatus (100) of a guide roll comprises a first auxiliary device (110), a load-lock chamber (120), a cleaning and heating chamber (130), first and second vacuum chambers (140,140'), a cooling chamber (150), an unload-lock chamber (160), a vacuum pump, first to seventh vacuum valves (a-g), and a second auxiliary device (190). The first and second vacuum chambers are close to the cleaning and heating chamber and plate the guide roller with a film. The unload-lock chamber is close to the cooling chamber. The state of the unload-lock chamber is changed between atmospheric pressure and a vacuum state to unload the guide roll. The second auxiliary device is close to the unload-lock chamber to withdraw the guide roll from the unload-lock chamber.;COPYRIGHT KIPO 2013;[Reference numerals] (AA,BB) Cathode
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