首页> 外国专利> LIGHT EMITTING DIODE PRINTED CIRCUIT BOARD CAPABLE OF IMPROVING PRICE COMPETITIVENESS

LIGHT EMITTING DIODE PRINTED CIRCUIT BOARD CAPABLE OF IMPROVING PRICE COMPETITIVENESS

机译:能够提高价格竞争力的发光二极管印刷电路板

摘要

PURPOSE: A light emitting diode (LED) printed circuit board (PCB) is provided to maximize light reflection rates by combining an aluminum piece and a thermal conductive polymer.;CONSTITUTION: An aluminum piece (102) includes high reflection rates. A component is projected to the aluminum piece and thermal conductive polymer resin. A PCB is comprised of the components. An epoxy PCB (103) forms a circuit pattern layer. The PCB circuit board and the epoxy PCB are attached from each other.;COPYRIGHT KIPO 2013;[Reference numerals] (100) Graphite composite PCB of the present invention; (101) Thermal conductive polymer injection piece (Base substrate layer); (102) Aluminum piece (Reflection rate layer); (103) Epoxy PCB containing a circuit pattern layer
机译:目的:提供一种发光二极管(LED)印刷电路板(PCB),以通过结合铝片和导热聚合物来最大化光反射率。;组成:铝片(102)具有高反射率。部件投射到铝片和导热聚合物树脂上。 PCB由这些组件组成。环氧树脂PCB(103)形成电路图案层。 PCB电路板和环氧树脂PCB彼此附接。COPYRIGHT KIPO 2013; [附图标记](100)本发明的石墨复合PCB; (101)导热性高分子注入片(基底基板层); (102)铝片(反射率层); (103)包含电路图案层的环氧树脂PCB

著录项

  • 公开/公告号KR20130088222A

    专利类型

  • 公开/公告日2013-08-08

    原文格式PDF

  • 申请/专利权人 BOMYUNG;

    申请/专利号KR20120009322

  • 发明设计人 SON BACK HWAN;

    申请日2012-01-31

  • 分类号H05K1/02;H05K7/20;H01L33/64;

  • 国家 KR

  • 入库时间 2022-08-21 16:26:30

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