PCB HAVING INDIVIDUAL REFLECTIVE LAYER AND METHOD FOR FABRICATING OF LIGHTING EMITTING DIODE PACKAGE USING THE SAME

摘要

PURPOSE: A PCB with an individual reflection layer for facilitating and an LED package manufacturing method using the same are provided to prevent the re-absorption of light between LED chips, thereby improving the optical efficiency. CONSTITUTION: A printed circuit board (PCB) with an individual reflection layer comprises material layers for formation of wire pattern, dams, and a light re-absorption prevention dam. The material layer is formed across an insulating layer on the PCB. The dams are formed on the material layer of a peripheral with the chip mounting area of the PCB as the center. The light re-absorption prevention dam is formed on the material layer between areas where LED chips are mounted. The PCB of a chip on board (COB) or chip on heat sink (COH) type is equipped with one or more LED chips within one package. [Reference numerals] (AA) DAM structure; (BB) Insulation layer