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RESIN COMPOSITON FOR HIGHLY THERMAL CONDUCTIVE INSULATING MATERAIL AND INSULATING FIME

机译:用于高导热绝缘材料和绝缘薄膜的树脂组合物

摘要

PURPOSE: A resin composition is provided to offer an insulating material capable of realizing an excellent thermal conductivity without a degradation o inner voltage intensity. CONSTITUTION: A resin composition for insulating material comprises: a thermal conductive ceramic compound comprising alumina (Al2O3); graphene oxide; and a thermosetting resin. The graphene oxide is obtained from graphite oxide having more than 8.700 of d-spacing. The thermosetting resin comprises more than one kind selected among epoxy resin, polyimide resin, phenoxy resin, and acrylic resin. The insulating film comprises: a thermosetting resin hardened on the film; graphene oxide and thermal conductive ceramic compound dispersed in the thermosetting resin. [Reference numerals] (AA) LED chip; (BB) Insulation film; (CC) Metal PCB; (DD) Graphene oxide; (EE) Polymer matrix; (FF) Ceramic powder; (GG) LED heat discharge package view; (HH) Ceramic/graphene oxide composite insulation film view
机译:目的:提供一种树脂组合物以提供能够实现优异的导热性而不会降低内部电压强度的绝缘材料。组成:用于绝缘材料的树脂组合物包括:导热陶瓷化合物,包括氧化铝(Al2O3);氧化石墨烯和热固性树脂。所述氧化石墨烯由具有大于8.700的d-间隔的氧化石墨获得。热固性树脂包括从环氧树脂,聚酰亚胺树脂,苯氧基树脂和丙烯酸树脂中选择的一种以上。绝缘膜包括:在膜上硬化的热固性树脂;和氧化石墨烯和导热陶瓷化合物分散在热固性树脂中。 [参考数字](AA)LED芯片; (BB)绝缘膜; (CC)金属PCB; (DD)氧化石墨烯; (EE)聚合物基质; (FF)陶瓷粉; (GG)LED散热封装视图; (HH)陶瓷/氧化石墨复合绝缘膜视图

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