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PHOTOCURABLE RESIN COMPOSITION, DRY FILM AND CURED OBJECT OBTAINED THEREFROM, AND PRINTED WIRING BOARD OBTAINED USING THESE
PHOTOCURABLE RESIN COMPOSITION, DRY FILM AND CURED OBJECT OBTAINED THEREFROM, AND PRINTED WIRING BOARD OBTAINED USING THESE
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机译:从中获得可光固化的树脂成分,干膜和固化物体,并从中获得印刷线路板
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摘要
The purpose of the present invention is to provide a photocurable and alkaline-solution-developable resin composition which, even when containing a filler incorporated in a large quantity, gives a solder resist that has satisfactory handleability and can be inhibited from cracking or peeling off during thermal shock cycles. The composition comprises a carboxylated oligomer, a polymeric binder that has a higher molecular weight than the carboxylated oligomer, a photopolymerization initiator, a photopolymerizable monomer, and a filler, wherein the content of the filler is 30-60 mass% with respect to the total amount of the nonvolatile components of the composition. A thermoplastic resin is suitable as the polymeric binder, and the thermoplastic resin preferably is in the state of having been dissolved in a solvent so that the thermoplastic-resin solution has a solid content of 10-50 wt.%. The photocurable resin composition or a dry film obtained therefrom is advantageously applicable to the formation of a cured film such as the solder resist of a printed wiring board.
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