THICKNESS AND SHAPE MEASURING DEVICE USING AN OPTICAL METHOD AND A MEASURING METHOD THEREOF, WHICH IS STABLE IN RESPECT TO EXTERNAL VIBRATION AND A TEMPERATURE CHANGE AND OBTAINS HIGH MEASUREMENT ACCURACY

摘要

PURPOSE: A thickness and shape measuring device using an optical method and a measuring method thereof are provided to measure the thickness and a shape of the entire wafer without damage to a measurement sample or the contamination of the measurement sample in a short time.;CONSTITUTION: A thickness and shape measuring device using an optical method includes a light source (10), a reference reflective plate (60), a light transmitting unit (20), a spectrometer (70), and a signal processing unit (80). The light source emits lights in which the width of a wavelength is more than 30 nm. The reference reflective plate includes a reference reflective surface (62) and a plurality of supporters (61). The reference reflective surface reflects the lights reaching the reference reflective surface after penetrating through a measurement sample (50). The supporter separates the reference reflective surface and the measurement sample at a predetermined interval. The light transmitting unit receives first reflected lights (12), second reflected lights (14), and third reflected lights (16). The spectrometer detects the optical power of coherent lights according to frequencies, thereby measuring an optical spectrum.;COPYRIGHT KIPO 2013;[Reference numerals] (10) Light source; (70) Spectrometer; (80) Signal processing unit; (AA) Incident light route; (BB) Reflected light route