SUBSTRATE FOR PRINTED CIRCUIT BOARD USING AN ALUMINUM FOIL CAPABLE OF REDUCING THE TIME THAT IS REQUIRED IN AN ETCHING PROCESS, AND A METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A substrate for printed circuit board using an aluminum foil and a method for manufacturing the same are provided to weld the same type of metal by using an aluminum wire as a bolding wire, thereby improving the quality of welding.;CONSTITUTION: An aluminum base (11) acts for manufacturing the metal printed circuit board (PCB). The bonding surface (12a) of an aluminum foil (12) is surface-treated with the pattern. The opposite surface (12b) to the bonding surface of the aluminum foil is polished. The bonding sheet (13) is interposed between the aluminum base and the aluminum foil. The bonding sheet bonds the bonding surface of aluminum foil to the aluminum base by heating and pressing.;COPYRIGHT KIPO 2013