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HEAD ASSEMBLY OF A CHIP MOUNTER, CAPABLE OF IMPLEMENTING EFFICIENT SPINDLE SELECTION MECHANISM

机译:芯片安装器的头部组件,能够实现有效的主轴选择机制

摘要

PURPOSE: A head assembly of a chip mounter is provided to lighten the weight of a chip mounter head by implementing vertical driving of a plurality of spindles with a single or minimum number of actuators.;CONSTITUTION: A plurality of selectors (120) is installed on the upper part of a plate (110). The plurality of selectors includes an inner bump protruded to the inner side. The plurality of spindles is located in the lower part of the plate in correspondence to the plurality of selectors respectively. The plurality of spindles includes an outer bump (131) going in gear with the inner bump of the selector. A vertical driving module (140) drives the plate up and down. A rotary motor (150) rotates the plurality of selectors installed on the upper part of the plate.;COPYRIGHT KIPO 2013
机译:目的:提供一种芯片安装机的头组件,以通过使用单个或最少数量的致动器实现多个主轴的垂直驱动来减轻芯片安装机头的重量。;组成:安装了多个选择器(120)在板(110)的上部。多个选择器包括向内侧突出的内部凸起。多个心轴分别对应于多个选择器位于板的下部。多个心轴包括与选择器的内部凸块齿轮啮合的外部凸块(131)。垂直驱动模块(140)上下驱动板。旋转电机(150)旋转安装在平板上部的多个选择器。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130119216A

    专利类型

  • 公开/公告日2013-10-31

    原文格式PDF

  • 申请/专利权人 SAMSUNG TECHWIN CO. LTD.;

    申请/专利号KR20120042199

  • 发明设计人 HONG SUNG RYONG;

    申请日2012-04-23

  • 分类号H05K13/04;H01L21/60;

  • 国家 KR

  • 入库时间 2022-08-21 16:26:02

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