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HEAD ASSEMBLY OF A CHIP MOUNTER, CAPABLE OF IMPLEMENTING EFFICIENT SPINDLE SELECTION MECHANISM
HEAD ASSEMBLY OF A CHIP MOUNTER, CAPABLE OF IMPLEMENTING EFFICIENT SPINDLE SELECTION MECHANISM
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机译:芯片安装器的头部组件,能够实现有效的主轴选择机制
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摘要
PURPOSE: A head assembly of a chip mounter is provided to lighten the weight of a chip mounter head by implementing vertical driving of a plurality of spindles with a single or minimum number of actuators.;CONSTITUTION: A plurality of selectors (120) is installed on the upper part of a plate (110). The plurality of selectors includes an inner bump protruded to the inner side. The plurality of spindles is located in the lower part of the plate in correspondence to the plurality of selectors respectively. The plurality of spindles includes an outer bump (131) going in gear with the inner bump of the selector. A vertical driving module (140) drives the plate up and down. A rotary motor (150) rotates the plurality of selectors installed on the upper part of the plate.;COPYRIGHT KIPO 2013
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