Electroless copper plating solution including anionic surfactant for wiring and copper coating layer prepared by the same

摘要

This invention is a copper ion , a copper ion complexing agent , a copper ion reducing agent , pH adjusting agent and the anionic addition catalyst by including a surfactant , 1) represents a layer possessing stress (Stress) , and bonding strength reduction effect by increasing the surface active effect 2) the main required properties of resistance decreases and the fine pores of the wiring trench application material (Void) and Sim (Seam ) relates to the amount of the diagram and wiring electroless copper whereby the prepared coating comprising an anionic surfactant which can be produced without defects such as a copper film . ;