ELECTROLESS COPPER PLATING SOLUTION INCLUDING A CATIONIC SURFACTANT FOR WIRING AND A COPPER PLATING LAYER PREPARED BY THE SAME TO ACTIVATE THE SURFACE OF A FOUNDATION LAYER

摘要

PURPOSE: An electroless copper plating solution including a cationic surfactant for wiring and a copper plating layer prepared by the same are provided to form a stable precipitation layer or copper layer by maintaining plating conditions including low temperatures of about 25°C and a proper pH range.;CONSTITUTION: An electroless copper plating solution including a cationic surfactant for wiring comprises copper sulfate pentahydrate as metallic salt, 37% formalin as a reducing agent, rochelle salt tetrahydrate as a complexing agent, nickel chloride hexahydrate as a catalyst, NaOH as a pH regulator, and a cationic surfactant selected from the group consisting of amine salt, quaternary ammonium salt, sulfonate, phosphonium salt, and a combination thereof.;COPYRIGHT KIPO 2012