LIFT-OFF DEPOSITION SYSTEM FEATURING A DENSITY OPTIMIZED HULA SUBSTRATE HOLDER IN A CONICAL DEPOSITION CHAMBER

摘要

The present invention relates to a vapor deposition apparatus using a lift-off process, and the evaporation source, the evaporation source the space frame and is mounted to rotate about a first axis passing through the center point and a central dome-shaped wafer holder mounted on the space frame so that it is aligned with the first axis, the space frame of the branch (offset) from the first axial position mounting includes a dome-shaped wafer holder, the wafer holder and a plurality of dome-shaped central location on the dome-shaped wafer of the wafer holder of the orbit to orbit relative to the second rotation axis passing through the center point and the evaporation source of the dome-shaped wafer holder, of the orbit and, a plurality of wafer positions each of which is branched from the first axis and the second axis. Each of the plurality of wafer position to a substantially orthogonal to the radial axis (radial axis) extending in a substrate surface of a wafer mounted therein to evaporation source from the wafer position for rotation about the first axis and the second axis adapted to orientation. ;