Structure and manufacture method for multi-row lead frame of semiconductor package

摘要

The present invention is to provide a multi-row lead frame and a method of manufacturing a semiconductor package, the leadframe material a first step of coating with a photoresist; A second step of patterning the lead frame and the material; And a third step of plating the lead frame with the patterned material; And a fourth step of peeling the photoresist; A fifth step of etching the lead frame material; configured by including, a metallic carrier material through the selection of etching and plating to manufacture a multi-row lead frame according to the conventional metal-coated carrier material for introduction of a lead frame structure and formed removing a portion of the raw material costs increase due to the complete removal of the problem raised and the carrier material occurring in the production process, and relatively, it is possible to manufacture a multi-row lead frame as the cost reduction.