MULTI-ROW LEAD FRAME WHICH CAN MANUFACTURE VARIOUS LEAD FRAME BY INTRODUCING VARIOUS SURFACE PROCESS AND SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A multi-row lead frame, and the semiconductor chip package and manufacturing method thereof apply the single step preferential etching. The undercut of pattern is minimized.;CONSTITUTION: A first pattern is formed in the metal material(ST1). The surface coating processing or the organic compound coating operates after the formation of the first pattern(ST2). The second pattern is formed in the metal material(ST3). The semiconductor chip is packaged after the formation of the second pattern(ST4). The photosensitive material is spread for the formation of the first pattern in the metal material.;COPYRIGHT KIPO 2010