Tin-based solder ball and semiconductor package having the same

摘要

the technical concept having the properties required for the alloy to the solder ball suitable for use in electronic products of the present invention the tin -based solder balls provides . Of the tin-based solder balls according to an embodiment of the present invention , 0.3 wt% to 3.0 wt% range (Ag); 0.4 wt% to 0.8 wt% range of copper (Cu); 0.01 wt% to 0.09 wt% range of nickel (Ni); And 0.1 wt% to 0.5 wt% of bismuth in the range of (Bi);. Contains , consists of a glass portion of tin (Sn) and unavoidable impurities ;