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ADHESIVE COMPOSITION FOR DIFFICULTY ADHESION MATERIAL WITHOUT PRE-TREATMENT PROCESS

机译:无预处理工艺的难粘材料的胶粘剂组合物

摘要

PURPOSE: An adhesive composition not requiring a pretreatment process is provided to simplify processes, to reduce manufacturing costs, to improve working environment, and to improve heat resistance properties and phototropy. CONSTITUTION: An adhesive composition consists of 110-130 parts by weight of a tackifier resin, 20-40 parts by weight of a viscosity modifier, and 1-3 parts by weight of an oxidation stabilizer per 100.0 parts by weight of a polymer substrate. The polymer substrate consists of 35-65 wt% of a styrene block copolymer-based resin, 20-35 wt% of a modified ethylene vinyl acetate copolymer resin, and 15-30 wt% of a thermoplastic polyurethane complex. The styrene block copolymer-based resin has a melt index of 5-30 g/10 min (200C, 5kg) and contains 10-30 % of styrene.
机译:用途:提供不需要预处理过程的粘合剂组合物,以简化过程,降低制造成本,改善工作环境并改善耐热性和光致各向异性。组成:粘合剂组合物由每100.0重量份的聚合物基材中110-130重量份的增粘剂树脂,20-40重量份的粘度调节剂和1-3重量份的氧化稳定剂组成。聚合物基材由35-65重量%的基于苯乙烯嵌段共聚物的树脂,20-35重量%的改性的乙烯-乙酸乙烯酯共聚物树脂和15-30重量%的热塑性聚氨酯络合物组成。苯乙烯嵌段共聚物基树脂的熔体指数为5-30g / 10min(200℃,5kg),并含有10-30%的苯乙烯。

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