MANUFACTURING METHOD OF SOLVENT-CONTROLLABLE SILICA-EPOXY HYBRID PACKAGING MATERIAL, CAPABLE OF BEING APPLIED TO ELECTRIC, ELECTRONIC, AND ENERGY DEVICES

摘要

PURPOSE: A manufacturing method of solvent-controllable silica-epoxy hybrid packaging material is provided to prevent the shrinkage in drying or curing reaction by substituting an organic solvent contained in surface treated silica with a functional organic monomer.;CONSTITUTION: A manufacturing method of solvent-controllable silica-epoxy hybrid packaging material comprises: a step of forming a silica nanosol of colloidal phase; a step of treating the surface of the silica nanosol by adding a functional organic metal alkoxide containing organic functional group to the silica nanosol; a step of manufacturing an organic solvent-controllable silica nanosol by replacing a solvent contained in the silica nanosol with a different organic solvent; a step of manufacturing a solventless organic and inorganic hybrid material by substituting the organic solvent contained in the silica nanosol with a functional organic monomer having epoxy group; and a step of forming a hybrid packaging material by adding a curing agent to the solventless organic and inorganic hybrid material.;COPYRIGHT KIPO 2013