A method for fabricating an integrated lead less - housing - circuit, and integrated lead less - housing - circuit

摘要

A method for fabricating an integrated lead less - housing - circuit, comprising the steps of:– Providing a leadframe - frame (1) with an upper side and a lower side and at least one leadframe - section (2, 3, 4, 5) in one of a plastic housing (6) surrounding a semiconductor device is provided, with which is formed as conductor tracks (7) regions of the leadframe - section (2, 3, 4, 5) an outer surface of the plastic housing (6) penetrate,wherein, prior to a step of severing of the conductor tracks (7) to singulate an integrated circuit of the step of:– Acting upon at least of a transition area between the plastic housing (6) and conductor tracks (7) with high-energy radiation from the surface - and the underside of the leadframe - frame, and indeed in such a way that, in the transition area of the parts of the plastic housing (6) are removed,– Separation of the conductor tracks (7) to singulate of the integrated lead less - housing - circuit under producing separating surfaces (10), so that between each of the separating surface (10) and a region of the respective separating surface (10) surrounding plastic housing (6), in plan view on..