A process for the formation of highly resolved structures with the desired thickness or a high aspect ratio by means of lower ablation

摘要

A process for the formation of a high-resolution structure (20) with a desired thickness or a high aspect ratio by means of lower ablation by partial removal of a on a substrate (10) is applied to the victims of film (30) and depositing a functional material (m) in the region of which the sacrificial film (30) has been removed, the method comprising:a sacrificial film - applying step (s1) of applying a victim of film (30) having a thickness of 100 × β / α (μm) or more on the substrate (10) by means of a laminator, with the proviso that the proportion by volume of the functional material, which ultimately remain behind as a film is, α (volume -%), and in that the required thickness of the structure β (μm); wherein the oper film (30) of a plurality of layers is composed:– a protective layer, to prevent the contamination of which, before and during the process occurs;– a sacrificial layer, which, by the use of a focused energy beam can be removed easily;– a light shield layer, in order to..