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A semiconductor device and method for the production of a hybrid contact structure with contacts with a small aspect ratio in the case of a semiconductor device

机译:在半导体器件的情况下,一种半导体器件和用于制造具有小纵横比的触点的混合触点结构的方法

摘要

A method with:Forming a dielectric layer by means of a circuit element, which is a in a semiconductor region has a contact region;Forming a contact element in the dielectric layer in such a way that it establishes a connection to the contact region, wherein the contact element has a first conductive material;Forming a depression in the contact element by removing a portion of the first conductive material;Form of a trench in the dielectric layer after the forming of the depression, wherein the trench is in connection with the contact element;Forming a barrier material layer in the recess; andFilling of the recess with a second conductive material, which is distinguished from the first conductive material, after the forming of the barrier material layer.
机译:一种方法,该方法包括:通过在半导体区域中的具有接触区域的电路元件形成介电层;在介电层中形成与该接触区域建立连接的接触元件,其中接触元件具有第一导电材料;通过去除第一导电材料的一部分在接触元件中形成凹陷;形成凹陷之后,在电介质层中形成沟槽,其中沟槽与接触件连接。元件;在凹槽中形成阻挡材料层;在形成阻挡材料层之后,用不同于第一导电材料的第二导电材料填充凹槽。

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