Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged

摘要

The micromechanical sensor device has a substrate (1), a circuit chip fixed on the substrate and a mold package, in which the circuit chip is packaged. The mold package has a recess located above the circuit chip, in which a sensor chip is formed. The mold package has a through hole at the base of the recess, opened by a laser beam and extending to a metallization area (2). An electrical connection of the sensor chip is guided on the metallization area formed as contact area on the substrate or on the circuit chip. An independent claim is included for a method for manufacturing a micromechanical sensor device.