Cooling housing useful for accommodating electronic components, comprises heat pipes for cooling the electronic components, and are integrated with the cooling housing, and contain a liquid fluid that evaporates under heat absorption

摘要

Cooling housing (1) for accommodating electronic components, comprises heat pipes for cooling the electronic components, and are integrated with the cooling housing. The heat pipes contain a liquid fluid (40) that evaporates under heat absorption and condenses under heat output. The heat pipes are formed during the manufacture of the cooling housing by a generative manufacturing method. The respective heat pipes comprise a fluid-impermeable outer wall (28) and a fluid permeable inner wall (30) defining a steam channel (42). An independent claim is also included for manufacturing the cooling housing using generative manufacturing method, comprising forming the heat pipes integrally with the cooling housing.