Vapor chamber radiator for use in electronic product, has capillary and supporting structures provided in cavity, where capillary structure is formed at walls of cavity and supporting structure is connected with metal and ceramic plates

摘要

The radiator has a main body (1) comprising a metal plate (11) and a ceramic plate (12), which are connected with each other. The main body forms a cavity, and a capillary structure (14) and a supporting structure (15) are provided in the cavity. The capillary structure is formed at inner walls of the cavity, and the supporting structure is connected with the plates by soft soldering, braze welding, diffusion bonding, ultrasonic welding or direct bonding copper. The capillary structure is formed by sinter powder, net bodies or grooves. The supporting structure is formed by copper rods. An independent claim is also included for a vapor chamber radiator manufacturing method.