Joining component with substrate, comprises e.g. placing component on terminal contact of substrate, and connecting terminal of component with terminal contact of substrate by solder, where component is fixed after placing on substrate

摘要

Joining a component (2) having at least one electrical terminal, with a substrate (1), comprises providing the substrate with electrical terminal contact for the component, placing the component with its terminals on a terminal contact of the substrate, connecting the terminal of the component with the terminal contact of the substrate by a solder, and melting the solder by heat of a laser beam for a predetermined time period, where the component is fixed at least after the placing on the substrate by a component holder (3), and the laser beam (6) is directed on the component holder. Joining a component (2) comprising at least one electrical terminal, with a substrate (1), comprises providing the substrate with electrical terminal contact for the component, placing the component with its terminals on a respectively corresponding terminal contact of the substrate, connecting the terminal of the component with the terminal contact of the substrate by a solder, and melting the solder by heat of a laser beam for a predetermined time period, where the component is fixed at least after the placing on the substrate by a component holder (3), and the laser beam (6) is directed on the component holder, which is in contact with the component such that the heat is produced for melting the solder on the component holder.