Method for making network of connecting vias that are utilized for connecting metal lines of integrated circuit, involves locating pattern at point, and manufacturing vias from mask, where each pattern exhibits orientation direction

摘要

The method involves making a hard mask that is provided with a network of patterns (2), where the patterns correspond to locations of connecting vias (20). Each pattern is located at an intersection point between a portion of lower metallization level metal lines (60-62) and a portion of higher metallization level metal lines (63-65), where each pattern exhibits a general orientation direction (B) that is inclined at a non-zero angle with respect to an orientation direction (A) of the portion of the lower metallization level metal lines. The connecting vias are manufactured from the hard mask. An independent claim is also included for an integrated circuit.