Method for realizing three-dimensional integrated structure, involves realizing electrically conductive through-connection extending between non-assembled face and metal line of interconnection part of one of two integrated circuits

摘要

The method involves directly bonding a front face of an integrated circuit (C11) and a front face of another integrated circuit (C12), where the front faces comprise insulating material and copper material. An electrically conductive through-connection extending between a non-assembled face (BF11), of the former integrated circuit, opposed to the former front face, and a metal line (LM1) of an interconnection part of one of the two integrated circuits, is realized. The latter integrated circuit is positioned within an integrated circuit board. The integrated circuit bonded to another integrated circuit is partially encapsulated in a resin. An independent claim is also included for a three-dimensional (3D) integrated structure.