首页> 外国专利> Silicon-on-insulator structure for use in e.g. electronic application, has central layer made of electrically insulating material different from material of lower and upper layers that consist of silicon oxide to stabilize central layer

Silicon-on-insulator structure for use in e.g. electronic application, has central layer made of electrically insulating material different from material of lower and upper layers that consist of silicon oxide to stabilize central layer

机译:绝缘体上的硅结构,例如用于电子应用,其中心层由电绝缘材料制成,该绝缘层不同于由氧化硅组成的用于稳定中心层的上下层材料

摘要

The structure (1) has an electrically insulating structure (20) inserted between a support substrate (10) and a top layer (31). The insulating structure comprises an electrically insulating central layer (22) with a thickness ranging between 2 and 10 nm and placed between an electrically insulating lower layer (21) and an electrically insulating upper layer (23). The central layer is made of electrically insulating material different from a material of the lower and upper layers. The lower and the upper layers consist of silicon oxide to stabilize the central layer. An independent claim is also included for a method for manufacturing a silicon-on-insulator structure.
机译:结构(1)具有插入在支撑基板(10)和顶层(31)之间的电绝缘结构(20)。绝缘结构包括厚度在2nm至10nm之间的并且位于下部电绝缘层(21)和上部电绝缘层(23)之间的中央电绝缘层(22)。中央层由与下层和上层的材料不同的电绝缘材料制成。下层和上层由氧化硅组成,以稳定中心层。还包括用于制造绝缘体上硅结构的方法的独立权利要求。

著录项

  • 公开/公告号FR2984598A1

    专利类型

  • 公开/公告日2013-06-21

    原文格式PDF

  • 申请/专利权人 SOITEC;

    申请/专利号FR20110061920

  • 发明设计人 ALLIBERT FREDERIC;LANDRU DIDIER;

    申请日2011-12-19

  • 分类号H01L21/76;H01L27/12;

  • 国家 FR

  • 入库时间 2022-08-21 16:21:00

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