首页> 外国专利> PASTY METAL PARTICULATE COMPOSITION, METHOD FOR MANUFACTURING SOLID METAL OR SOLID METAL ALLOY, METHOD FOR JOINING METALLIC MEMBERS, METHOD FOR MANUFACTURING PRINT WIRE BOARD, AND METHOD FOR MANUFACTURING BUMP FOR CONNECTING ELECTRIC CIRCUITS

PASTY METAL PARTICULATE COMPOSITION, METHOD FOR MANUFACTURING SOLID METAL OR SOLID METAL ALLOY, METHOD FOR JOINING METALLIC MEMBERS, METHOD FOR MANUFACTURING PRINT WIRE BOARD, AND METHOD FOR MANUFACTURING BUMP FOR CONNECTING ELECTRIC CIRCUITS

机译:过去的金属微粒组成,制造固态金属或固态金属合金的方法,结合金属构件的方法,制造印刷线路板的方法以及制造用于连接电路的插头的方法

摘要

PROBLEM TO BE SOLVED: To provide a pasty metal particulate composition yielding, when heated, a solid metal excellent in terms of adhesive strength, hardness, electroconductivity, and heat conductivity as a result of the sintering of metal particulates at a relatively low temperature, a method for manufacturing a solid metal, and a method for joining metallic members, etc.;SOLUTION: The provided pasty metal particulate composition is either a pasty metal particulate composition obtained by mixing: heat-sinterable metal particulates whose surfaces are coated with an organic substance; a polymer dispersant possessing acidic functional groups and basic functional groups; and a volatile dispersion medium having a boiling point of 70°C to 300°C and then aging the resulting mixture at -50°C to +25°C at least over a specified time or a corresponding pasty metal particulate composition additionally including heat-sinterable metal particles each yielding, when heated, a solid metal, etc., following the evaporation of the volatile dispersion medium as a result of the mutual sintering of the heat-sinterable metal particulates or of the sintering of the heat-sinterable metal particulates and the heat-sinterable metal particles. A method for manufacturing a solid metal, etc., by heating the pasty metal particulate composition, a method for firmly joining metallic members by using the pasty metal particulate composition, a method for manufacturing a print wire board possessing metal wires, and a method for manufacturing a bump for connecting electric circuits are additionally provided.;COPYRIGHT: (C)2014,JPO&INPIT
机译:要解决的问题:提供一种糊状金属微粒组合物,该组合物在加热时产生的固态金属由于在较低温度下进行烧结而在粘合强度,硬度,导电性和导热性方面均优异,固体金属的制造方法和金属部件的接合方法等;解决方案:提供的糊状金属微粒组合物是通过混合以下物质而获得的糊状金属微粒组合物:表面覆盖有有机物质的可热烧结金属微粒;具有酸性官能团和碱性官能团的聚合物分散剂;以及沸点为70°C至300°C的挥发性分散介质,然后将所得混合物在-50°C至+ 25°C的温度下至少经过指定的时间,或相应的糊状金属颗粒组合物(另外包括加热)由于可热烧结的金属颗粒相互烧结或可热烧结的金属颗粒与金属的相互烧结的结果,在挥发性分散介质蒸发之后,每个可烧结的金属颗粒在加热时都会产生固体金属等。可热烧结的金属颗粒。通过加热糊状金属微粒组合物来制造固体金属等的方法,通过使用糊状金属微粒组合物牢固地接合金属构件的方法,具有金属线的印刷线路板的制造方法以及用于制造该方法的方法。另提供制造用于连接电路的凸点的制造方法。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2014111800A

    专利类型

  • 公开/公告日2014-06-19

    原文格式PDF

  • 申请/专利权人 NIPPON HANDA KK;

    申请/专利号JP20120265924

  • 申请日2012-12-05

  • 分类号B22F9;B22F1/02;B22F3/22;B22F7/08;H01B1/22;H01B1;H01B13;H05K3/12;H01L21/60;B22F7/04;

  • 国家 JP

  • 入库时间 2022-08-21 16:20:12

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