Method for producing a heat sintered silver particles, paste Jogin particle composition, method of producing solid silver, method of joining the metal member, the manufacturing method and the electrical circuit manufacturing method of connecting bumps of the printed circuit board

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat-sinterable silver particle that, when heated, becomes a solid silver excellent in adhesion strength, hardness, electrical conductivity and thermal conductivity through sintering of the silver particle at a relatively low temperature, a paste-like silver particle composition, a method for manufacturing the solid silver, a method for joining metal members, and the like.;SOLUTION: A method for manufacturing a heat-sinterable silver particle comprises replacing a 5-24C monovalent fatty acid or a derivative thereof, which coats the surface of the silver particle, with a 2-4C polycarboxylic acid. A paste-like silver particle composition is a paste-like matter comprising the silver particle and a volatile dispersion medium having a dielectric constant of 20-80 and, when heated, becomes a solid silver through volatilization of the volatile dispersion medium and sintering of the silver particles with each other. A method for manufacturing the solid silver comprises heating the paste-like silver particle composition. The paste-like silver particle composition is used in a method for firmly joining metal members. A method for manufacturing a printed wiring board having silver wiring and a method for manufacturing an electric circuit connection bump are also provided.;COPYRIGHT: (C)2014,JPO&INPIT