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EMBOSSED CARRIER TAPE FORMING MOLD, AND EMBOSSED CARRIER TAPE

机译:压纹载带成型模具和压纹载带

摘要

PROBLEM TO BE SOLVED: To provide an embossed carrier tape forming mold in which heterogeneity of stress is dissolved when molding, and an embossed carrier tape in which a width length along a lengthwise direction becomes almost same can be obtained.;SOLUTION: Provided is a mold 10 in which recessed parts 32 paralleled in a feed direction by press molding in each shot for every feed are formed on a resin substrate 31 in which constant amount repeating feed is performed. The mold 10 includes: a first mold 11 including a stripper 11A and two or more draw punches 11B supported by the stripper 11A, paralleled in the feed direction, and forming the recessed parts 32 of the resin substrate 31; and a second mold 12 formed by a die 12A having two or more holes 12B that can insert the draw punches 11B of the first mold 11, and ribs 13 for forming stress relief concavities 33 to the resin substrate 31 are formed at each end part of the feed direction of the die 12A respectively neighboring the hole 12B.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种压花载体带成型模具,其中成型时消除了应力的不均匀性,并且可以获得压花载体带,其中沿着长度方向的宽度长度几乎相同。模具10在树脂基板31上形成有凹部32,该凹部32通过压制成型而在进给方向上平行于进给方向而平行于进给方向,该树脂基板31上进行恒定量的重复进给。模具10包括:第一模具11,其包括脱模器11A和由脱模器11A支撑的两个或更多个在其进给方向上平行的并形成树脂基板31的凹部32的拉伸冲头11B。在第二模具12的两端部形成有第二模具12,该第二模具12由具有能够插入第一模具11的拉模冲头11B的两个以上的孔12B的模具12A形成,在树脂基板31上形成有用于形成应力缓和凹部33的肋13。模具12A的进给方向分别与孔12B相邻;版权:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2014043028A

    专利类型

  • 公开/公告日2014-03-13

    原文格式PDF

  • 申请/专利权人 SHIN ETSU POLYMER CO LTD;

    申请/专利号JP20120185909

  • 发明设计人 NAKATA YUKI;HOSHI TAIJIRO;

    申请日2012-08-24

  • 分类号B29C51/30;B29C43/22;B29C43/34;B29C51/08;B65D73/02;B29L31/60;

  • 国家 JP

  • 入库时间 2022-08-21 16:19:48

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