BLASTING DEVICE FOR MACHINING SUBSTRATE CIRCUMFERENTIAL EDGE AND BLASTING METHOD USING THE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a blasting device that has a machining time shorter than a conventional machining device and is improved in productivity, which is the machining device for removing a thin layer in a substrate circumferential edge of a substrate with a thin layer formed on the surface thereof, and to provide a blasting method using the device.SOLUTION: A blasting device includes: a substrate circumferential edge machining mechanism, including a substrate circumferential edge machining chamber formed of a substrate loose insertion part for loosely inserting a substrate circumferential edge and a nozzle for injecting injection materials toward the substrate circumferential edge, and having a dust collection mechanism connected therewith; a substrate movement rotation mechanism for horizontally moving the substrate with the substrate mounted thereon relatively to the nozzle; and a lifting mechanism for lowering the substrate transport mechanism and displacing the substrate to the substrate movement rotation mechanism. The substrate circumferential edge machining mechanism can be disposed in the low position, so that the machining capability can be improved.