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SURFACE-TREATED COPPER FILM, LAMINATE SHEET, PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD

机译:表面处理铜膜,层压板,印制线路板和印制电路板

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper film, a laminate sheet, a printed wiring board and a printed circuit board having good suppressed transmission loss even when used in a high frequency circuit base board.;SOLUTION: There is provided a surface-treated copper film having a surface-treated layer and being in an area surrounded by 4 linear lines of x=0, y=0, y=-0.000189x+1.400000 and y=-0.002333x+9.333333 in the coating weight-surface roughness graph drawn with x axis as the total coating weight (μg/dm2) of Co, Ni, Fe and Mo in the surface-treated layer and y axis as the surface roughness of the surface-treated layer Rz(μm).;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:为了提供即使在高频电路基板中使用时也具有良好的抑制传输损耗的经​​表面处理的铜膜,层压板,印刷线路板和印刷电路板。表面处理过的铜膜,具有表面处理层,并且在涂层重量-表面粗糙度图,x轴表示表面处理层中Co,Ni,Fe和Mo的总涂层重量(μg/ dm 2 ),y轴表示表面处理层的表面粗糙度-处理层Rz(μm).;版权所有:(C)2014,日本特许厅&INPIT

著录项

  • 公开/公告号JP2014133936A

    专利类型

  • 公开/公告日2014-07-24

    原文格式PDF

  • 申请/专利权人 JX NIPPON MINING & METALS CORP;

    申请/专利号JP20130003859

  • 发明设计人 ARAI EITA;FUKUCHI RYO;

    申请日2013-01-11

  • 分类号C25D7/06;H05K1/09;

  • 国家 JP

  • 入库时间 2022-08-21 16:18:49

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