Treatment of the self-assembled monolayer of dielectric layer for epoxy adhesion improvement

摘要

To improve the epoxy adhesion to the self-assembled monolayer coating, the disclosure provides a system for processing a self-assembled monolayer coating the dielectric layer, the method and apparatus. The implementation of the method, the dielectric layer on the surface of the substrate is provided. Self-assembled monolayer coating is formed on the dielectric layer. Seal area of ​​the self-assembled monolayer coating is selectively processed. Component is bonded to the sealing area of ​​the self-assembled monolayer coating with epoxy. Implementation of the method can be used to encapsulate the electromechanical system devices on a substrate using a cover using epoxy.