The photosensitive resin composition, the photosensitive resin composition pattern forming material comprising a pattern forming method, and the photosensitive resin composition using an article, as well as the light latent resin curing accelerator

摘要

PPROBLEM TO BE SOLVED: To provide: a photosensitive resin composition excellent in sensitivity and giving large solubility contrast between an exposed area and an unexposed area, regardless of the kinds of polymer precursors; and a photo-latent resin curing accelerator utilizable for such the photosensitive resin composition. PSOLUTION: This photosensitive resin composition includes: a polymer precursor the reaction of which to a final product is accelerated by a basic substance or by heating in the presence of a basic substance; a secondary amine expressed by formula (1), and having an NH group formable of an amide bond; and/or a photo-latent resin curing accelerator generated by heating and electromagnetic wave irradiation applied to a heterocyclic compound. In the formula, RSP1/SPand RSP2/SPare each independently a monovalent organic group, RSP1/SPand RSP2/SPmay be same or different, and may link together to form a cyclic structure, and may include a hetero atom bond; RSP3/SP, RSP4/SP, RSP5/SPand RSP6/SPare each hydrogen, a monovalent organic group or a halogen, and they may be same or different, two or more thereof may link together to form a cyclic structure, and may include a hetero atom bond. PCOPYRIGHT: (C)2011,JPO&INPIT