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SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY IMPLANTATION OF CARBON CLUSTER

机译:通过注入碳团制造半导体器件的系统和方法

摘要

PROBLEM TO BE SOLVED: To improve the characteristics of transistor junctions by implantation of a carbon cluster into a substrate when the substrate is doped with boron and phosphorus in manufacturing PMOS transistor structures in integrated circuits.SOLUTION: Diffusion control for USJ formation and high dose amount carbon implantation for stress engineering are performed. At first, a cluster carbon ion such as CHis implanted into a source/drain region at approximately the same dose amount as the subsequent boron implant; and then, source/drain extensions are formed by performing a shallow boron, boron cluster, phosphorus or phosphorus cluster ion implant preferably using a borohydride cluster, such as BHor BH. Upon subsequent annealing and activation, the boron diffusion is reduced, due to the gettering of interstitial defects by the carbon atoms.
机译:解决的问题:在集成电路的PMOS晶体管结构的制造中,当衬底中掺有硼和磷时,通过向衬底中注入碳簇来改善晶体管结的特性。解决方案:扩散控制USJ形成和高剂量进行用于应力工程的碳注入。首先,将簇状碳离子(如CHs)以与随后的硼注入大致相同的剂量注入到源/漏区中。然后,通过优选使用诸如BH或BH的硼氢化物簇进行浅硼,硼簇,磷或磷簇离子注入来形成源/漏扩展。在随后的退火和活化后,由于碳原子吸收间隙缺陷,硼的扩散减少。

著录项

  • 公开/公告号JP2014160856A

    专利类型

  • 公开/公告日2014-09-04

    原文格式PDF

  • 申请/专利权人 SEMEQUIP INC;

    申请/专利号JP20140088858

  • 发明设计人 THOMAS N HORSKY;WADE A KRULL;

    申请日2014-04-23

  • 分类号H01L21/265;H01L21/8238;H01L27/092;H01L21/8234;H01L27/088;H01L21/322;H01L21/336;H01L29/78;

  • 国家 JP

  • 入库时间 2022-08-21 16:17:50

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