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DIAMOND GRINDING DEVICE AND DIAMOND GRINDING METHOD

机译:金刚石研磨装置及金刚石研磨方法

摘要

PROBLEM TO BE SOLVED: To provide a diamond grinding device and method little in dependency of grinding direction to the crystal orientation of diamond and having a grinding speed higher than that of the conventional diamond grinding devices.;SOLUTION: A diamond grinding device is provided with a rotating grinding plate 40 and a retention mechanism. The retention mechanism retains the diamond being an object to be ground and the grinding face 41 of the grinding plate 40 in a state contacting each other. In the grinding face 41 of the grinding plate 40, the material of at least the sliding face contacting with the diamond is a glass, and the softening point of the glass is 720°C or higher but 830°C or below.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种金刚石研磨装置和方法,该研磨装置和方法几乎不依赖于研磨方向与金刚石的晶体取向,并且其研磨速度高于常规金刚石研磨装置的研磨速度。旋转磨盘40和保持机构。保持机构将金刚石作为待磨削对象与磨盘40的磨削面41保持在彼此接触的状态。在研磨板40的研磨面41中,至少与金刚石接触的滑动面的材料是玻璃,并且该玻璃的软化点是720℃以上但830℃以下。 (C)2014,日本特许厅

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