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FIXTURE FOR THIN SHEET PLATING AND THIN SHEET PLATING METHOD

机译:薄板电镀固定装置及薄板电镀方法

摘要

PROBLEM TO BE SOLVED: To perform plating treatment while stably applying tenson to a thin sheet having flexibility.;SOLUTION: The substrate outer edge part of a thin sheet having flexibility is sandwiched with a grasping unit installed in the supporting frame of a thin sheet tension application fixture, and is applied with tension while being held. The thin sheet having flexibility is adsorbed on the adsorption table of a fixture detachable device for thin sheet plating, and while holding the same, the substrate edge of the thin sheet having flexibility is sandwiched with the upper frame and the lower frame of a fixture for thin sheet plating to close up the upper frame and the lower frame. The four corners of the closed upper frame and lower frame are pressed from the upper and lower parts with a clasp and are fixed, then the grasping unit is removed from the thin sheet having flexibility, and the thin sheet tension application fixture is separated to obtain a structure in which the thin sheet having flexibility is fixed while holding the tension with the fixture for thin sheet plating. The structure is installed in the fixture for plating, and the fixture for thin sheet plating is dipped into the plating tank together with the thin sheet having flexibility.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:在对具有挠性的薄片稳定地施加拉力的同时进行镀覆处理;解决方案:具有挠性的薄片的基板外边缘部分夹在安装在薄片张力的支撑框架中的夹持单元之间。施加夹具,并在保持状态下施加张力。具有挠性的薄板被吸附在用于薄板镀覆的夹具可拆卸装置的吸附台上,并且在将其保持的同时,将具有挠性的薄板的基板边缘夹在用于夹具的夹具的上框架和下框架之间。薄板电镀以封闭上框架和下框架。将闭合的上框架和下框架的四个角用卡扣从上部和下部压紧并固定,然后将抓握单元从具有柔韧性的薄板上取下,并分离薄板张力施加夹具以获得一种结构,其中具有挠性的薄板被固定,同时通过薄板电镀用夹具保持张力。该结构安装在用于电镀的夹具中,并将用于薄板电镀的夹具与具有柔性的薄板一起浸入电镀槽中。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2014015671A

    专利类型

  • 公开/公告日2014-01-30

    原文格式PDF

  • 申请/专利权人 NEC TOPPAN CIRCUIT SOLUTIONS INC;

    申请/专利号JP20120155423

  • 发明设计人 KANAYAMA MASAAKI;

    申请日2012-07-11

  • 分类号C25D17/06;C25D17/08;

  • 国家 JP

  • 入库时间 2022-08-21 16:17:08

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